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Characterization of Si Wafer Bonding by Injection-Dependent Recombination Velocity
Japanese Journal of Applied Physics, Part 2: Letters. 1995; 34:L806-L809
Publication type:
Article in journal
Permanent link (URI):
http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-1924
ISSN:
0021-4922
Authors:
Grivickas V, Thungström G, Bikbajevas V, Linnros J, Noreika D
SCB areas: |